ZEN 4 architecture and Ryzen 7000(X):
Before starting our tests, it seemed logical to remind you the new features brought by this new architecture.
AMD Zen 4 architecture:
Let’s take a look at the new AMD processors. These were announced at the end of August during a conference on YouTube. Dr. Lisa Su unveiled four new processors available for launch today. These new Ryzen 7000 processors benefit from a 5 nm etching by TMSC and are designed on the new Zen 4 architecture. To be totally precise, the CCD(core compute die) are indeed etched in 5 nm but the IOD (I/O die) remains on the N6 process (6 nm) from TSMC. The improvement of the engraving fineness allows the Ryzen 7000 to benefit from higher frequencies of origin as well as a better energy efficiency compared to the previous generation. We will come back to this in the details of the different processors.
As a reminder, the previous generation of Ryzen 5000s had a 7nm etch and the Zen 3 architecture, so it will be very interesting to measure the benefits of this new architecture.
What’s new in the Zen 4 architecture:
First of all, AMD has announced an expansion of the front-end as well as support for AVX-512 instructions. The new Ryzen 7000s also see the amount of L2 cache doubled from 512KB to 1MB of L2 cache per core, compared to the previous generation (Ryzen 5000).
On the other hand, there is no change in the amount of shared L3 cache memory, which remains at 32 MB per CCD. These various changes to the Zen 4 architecture should bring an average gain of IPC of 13% compared to Zen 3 according to AMD. We will check this performance in our tests.
Finally, you should know that these new processors have integrated RDNA 2 graphics cores (iGPU). We will detail below, in graphic form, all the characteristics of these new Ryzen 7000.
Four processors available at launch:
AMD unveiled four processors at its conference at the end of August. Let’s start with the Ryzen 7950X which will represent the flagship of this new architecture with 16 cores and 32 threads for a Boost frequency up to 5.7 GHz, and a price of $ 699. Then comes the Ryzen 7900X with 12 cores and 24 threads with a boost frequency of 5.6 GHz and a price of $ 549.
The other two processors announced are the Ryzen 7700X and its 8 cores (Boost at 5.4 GHz) and the Ryzen 7600X benefiting from 6 cores and 12 threads with a Boost at 5.3 GHz. It remains to be seen at what price these four processors will be announced in Europe and more particularly in France. The first prices indicated on online sites in the last few hours announce a still painful conversion to the euro. Since the publication of our first article, AMD has lowered the prices of these different Ryzen 7000.
In terms of cooling, AMD recommends the use of a 280mm AIO liquid cooling system for the Ryzen 7950X and 7900X. For the Ryzen 7700X and 7600X, a tower type cooling unit should do the job. We will of course give you our opinion at the end of this article.
Three new non-X processors:
These are of course the models we will test today. As we said in the introduction, they are distinguished by lower frequencies, a lower TDP and restrictions on overclocking. Here is a summary table of the complete offer since the CES 2023 announcements of this generation of Ryzen 7000. You will be able to judge the differences between the different models. Please note that the Ryzen 7000X3D models have just been announced at CES but will only be available in February.
Basically, these non-X chips offer the same characteristics as their X counterparts… At least on the number of cores/threads. Thus, the Ryzen 9 7900 displays 12c/24t, the Ryzen 7 7700 goes up to 8c/16t while the Ryzen 5 7600 offers 6c/12t. The same goes for the amount of cache memory, respectively 76 MB, 40 MB and 38 MB.
On the other hand, they highlight a reduced TDP of 65W. As a reminder, the 7900X is 170W of TDP, when we are at 105W for the 7600X and 7700X. However, in order to reduce the thermal envelope, it is necessary to reduce the frequencies. The processors lose between 100 MHz and 1 GHz on the base and boost frequencies.
One new socket, hello AM5 socket:
After the Z690 chipset and the LGA-1700 socket, it’s AMD’s turn to make its revolution. Goodbye socket AM4, hello socket AM5. It’s time to forget the PGA socket(Pin Grid Array) in which you used to put your processor in order to welcome the LGA socket(Land Grid Array). This socket will look like those already present for years on Intel motherboards. Why this change? Simply because of the larger number of pins on the Ryzen 7000 (1718).
AMD decided, with the AM5 socket, to keep a back plate already present for the AM4 socket. The 4 external holes that hold the retention system to fix your cooling system are still present. The distance between these 4 holes is identical to the AM4 socket, so you will still be able to use your cooling system as long as it uses the four external holes of the backplate!
But AMD goes further and adds 4 additional holes. These will be used to hold the AM5 socket in place but also to hold the backplate in place. This one should not be removed as on the previous generation. Finally, the locking mechanism changes. We find the reinforcement frame, the force frame and the latch. Once your Ryzen 7000 is placed in the right position, you just have to close the latch to keep it in place.
Small remark following my tests, where I have several times removed and put back these new Ryzen 7000, know that the grip is far from being obvious with the particular shape of the IHS. There is a risk of accidents if you are not careful with the processor which could slip out of your hands and damage the pins of the socket. So be careful!
PCI-Express 5.0 and DDR5 support:
The new AMD X670E chipset that we will test today with the AORUS X670E Master motherboard supports PCI-Express 5.0 as well as DDR5 support. AMD took the opportunity to unveil its AMD EXPO technology. It is an alternative to the XMP profile (A-XMP at AMD). As a reminder, the XMP allows, via the BIOS, to automatically activate the characteristics of your memory kit: frequency, timings and voltage. The AMD EXPO technology will also allow you to overclock DDR5 in a single click in combination with the Ryzen 7000.
The idea is to bring an extra gain through this automatic overclocking. The performance can improve up to 11% at 1080p and with a latency of less than about 63 nanoseconds. Of course, we’ll come back to this in detail in our EXPO-compatible memory kit tests. You should know that MSI has already responded by offering to include this technology on its Z690 motherboards.
Finally, you should know that other chipsets will be available in the coming weeks, in particular the much awaited B650E. Motherboards built around it should be more interesting financially.
Above is a summary table to understand the differences between these four chipsets . Let’s move on to the protocol of our comparative tests.
