New rumors about future Ryzen 8000 processors. A leaked AMD internal slide reveals the brand’s plans. We now know a little more about the brand’s next-generation processor!
Ryzen 8000: a 10% to 15% increase in IPC!
When we look at the roadmap in question, the Nirvana box refers to processors equipped with Zen5 cores. According to AMD, these will feature “new cores” symbolized by the red tile. But we’re more interested in what’s inside, since we can see the IPC gains expected from the red cores. These are rather interesting, since they show an increase of 10% to 15% compared with current Zen4 CPUs, which seems more reasonable to us than the 20% to 30% of previousleaks.
In addition to the other mentions in the slide, including the 48K cache, 6 ALUs, etc., etc., we also find the 4 nm and 3 nm engraving. As you know, AMD processors use a mix of different etch finishes, depending on whether they’re an I/O die or a core die.
Speaking of cores, it’s hard to say whether processors will continue to offer configurations as they do today. Indeed, it’s not impossible that the Reds will mix Zen 5 and Zen 5C (efficient) cores with their CPUs. In which case, we could see models with, say, eight Zen 5 cores and sixteen Zen 5c cores, Strix Point-style, via the presence of a 16-core Zen 5c complex.
And Ryzen 9000?
As you can see, the slide also mentions the Morpheus box. This time, the engraving should mix 3 nm and 2 nm. As for performance, we can expect an IPC gain of 10%, with the integration of FP16 instructions to facilitate all AI-related operations.
Finally, we can expect a new design. This time, the CCDs could be stacked directly on the I/O die, a way of minimizing latency between these elements. Now, what about the heating this will generate, the costs, etc., etc.? But we’re not there yet, so we’ll have to wait until the second half of 2025!
