As time goes by, PlayStation hardware evolves. As we saw two years ago, the console underwent an overhaul of its cooling system. Now, with the PS5 Slim, the cooling system is evolving once again. Some of the biggest videographers have already been able to take the console apart to see what’s inside!
The PS5 Slim taken apart!
Linus Tech Tips and Dave2D managed to get their hands on this new revision of the console. Overall, it appears that certain elements are easier to access, notably the optical drive compartment… The same goes for the M.2 slot for an additional SSD.
However, despite the fact that this is the ” slim ” version, the console does not benefit from a revised chip. In fact, it’s still the same 6nm Oberon Plus SoC, no change from the refresh version.
Here, the main change is in the console’s dimensions and cooling system. Firstly, the fan has evolved, with 19 blades. However, while the fan is slightly quieter, the noise is not in the same place. On this slim model, noise is more likely to be found in the optical drive area.
As for the cooling system, Sony still uses liquid metal as its thermal interface. However, it is still present in large quantities. What’s more, to prevent the metal from leaking anywhere, a protective foam is applied around the SoC die.
As for the heatsink itself, there’s a heat pipe attached to an aluminum fin block for the power supply stages. Otherwise, the chip itself features five heat pipes and two aluminum fin blocks. Clearly, compared with the previous version of the console, the base is smaller, but there is one more heat pipe. It remains to be seen what impact this will have on temperatures.
