Cooler Master presents a new heatsink: the V8 3DVC. It’s a top-of-the-range, very imposing heatsink featuring a steam chamber. The announced performance figures look promising!
V8 3DVC: a steam chamber in a cooler from Cooler Master!
As you can see, this is a very imposing heatsink. Indeed, don’t expect a model measuring less than 160 mm in height – we’re far from it. In fact, it features two Mobius 120s at the front and rear, surrounded by a particularly thick shroud!
The styling is neat, with an attractive frame. The frame features a number of markings, including the model number. The color scheme features dark blue on the fan blades, gray and black.
However, this heatsink is distinguished by the presence of a base containing a vapor chamber. This is filled with a liquid that captures the heat emitted by the CPU during operation. Then, when it reaches a certain temperature, it evaporates to carry the heat through the heat pipes. This vapor will then condense again and fall back as liquid to the base after cooling, and so on.
In short, the aim here is to improve the heatsink’s cooling performance. Cooler Master claims a TDP of 300W, 50W more than a conventional dual-tower fan.
Note that this kind of technology in CPU fans is not new. In the past, Sapphire offered one in its Vapor-X CPU cooler, which was a port of its graphics card cooling technology… But for CPUs.
