We’re continuing to take an interest in what’s happening in the field of engraving. After an article on Russia and its 350 nm, we now turn to Western technologies, which are much more advanced. TSMC is clearly ahead of schedule with its 2nm technology, and production could well begin by the end of 2025!
2 nm: two production sites ready for 2025?
As far as 2nm is concerned, things seem to be going well, since the company seems to be achieving good yields in its tests, with 60%. Bear in mind, however, that this notion is open to interpretation when we’re talking about processes, as we said here. On the other hand, things seem to be going well, with Hsinchu exceeding expectations and is even ahead by a quarter.
In concrete terms, the key point here is that the Hsinchu and Kaohsiung facilities will be the main fabs for producing wafers of this finesse. We’re talking about production capacities of 50,000 wafers, with a maximum set at 80,000 pieces per month for the time being. All this would enable TSMC to generate significant sales estimated at 30.1 billion US dollars, or 1,000 billion new Taiwanese dollars per plant. These are the figures given by Dan Nystedt on X.
Meanwhile, the first orders could be delivered by the end of the year. Of course, most of the first orders will come from Apple and its A20 for its new iPhone. However, other companies such as Qualcomm are also said to be on the case with its Snapdragon Elite Gen 3… That’s what the rumours seem to indicate.
In short, everything seems to be going well for TSMC at the moment, which is managing to master its process ahead of schedule. Currently, the only major competition for the company is Samsung and its future 2nm GAA. But yields are not yet satisfactory enough to make it available.
