Here’s a partnership we didn’t expect: between manufacturer G.SKILL and Cooler Master. G.SKILL is about to launch a new series of DDR5 modules called “MasterDimm AC”. These will feature active cooling designed by Cooler Master. We’re sure you’ll be able to find it at Computex 2026 in Taipei.
There was a time, particularly with DDR3 memory kits, when it was common practice to bundle an active cooling solution for high-end memory modules. Here, we’re talking about directly integrated cooling, which will be an integral part of the design of the “MasterDimm AC” series. Cooler Master indicates that the idea is to keep module frequencies constant over heavy workloads. Temperature gains could reach 15°C.
Each module will therefore be equipped with a fan and a heat sink, which has a direct influence on the width of the memory strip. It therefore seems impossible to us that it will be used on motherboards dedicated to overclocking and having only two memory slots. For other motherboards with four slots, you’ll have to sacrifice two.
The new “MasterDimm AC” series supports kits up to 2 x 64 GB. From AMD, the flagship kit will remain the AMD EXPO 6,000 MT/s CL26, and from Intel, Cooler Master announces Intel XMP 3.0 profiles that include DDR5 CU-DIMM kits up to 8,400 MT/s. No word yet on pricing or availability. We expect to find out more at Computex. Of course, we’ll try to get our hands on one when it becomes available.
