For the 75th anniversary of the transistor, Intel took advantage of the IEDM 2022 (International Electron Devices Meeting) to announce ambitious goals to project itself into the future and continue to assert that for the blue, Moore’s Law is not dead. Intel has set ambitious goals for 2030.
Keeping Moore’s Law alive for years to come
While earlier this year, Nvidia’s CEO, maintained that in his opinion, Moore’s Law was dead, Intel is targeting a further 10x improvement in density in packaging technology thanks in part to the use of a new material only 3 atoms thick to advance transistor scaling. At IEDM 2022, Intel’s component research group demonstrated its commitment to innovation in three key areas to continue Moore’s Law: new 3D hybrid bond packaging technology to enable seamless chip integration, ultra-thin 2D materials to fit more transistors on a single chip, and new power efficiency and memory opportunities for higher performance computing.
Obviously, all of these statements are based on ongoing research but also prospective. It goes without saying that there is still a long way to go before all these innovations, which are still mostly on paper, materialize. To realize how far we have to go, let’s keep in mind that a Core i9-13900K integrates 14.2 billion transistors… A way to visualize what represents 1000 billion transistors.
