On the memory front, we learn that development of the future DDR standard has begun. Indeed, Samsung, SK Hynix and Micron are said to be in contact with substrate producers to begin developing the technology. Despite this, developing a new memory standard takes time, and commercialization is not expected for another two or three years!
DDR6: Samsung, SK Hynix and Micron begin development!
Faster memory with bigger capacities!
With this new standard, we expect to see a sharp rise in RAM specifications. On the one hand, we’re talking about faster memory, with base frequencies of 8.4 Gbps, while more mature kits could reach 17.6 Gbps. Otherwise, in terms of capacity, we saw this with the LPDDR6 SOCAMM2 standard, where capacities of up to 512 GB were mentioned. With this new DDR, manufacturers should be able to integrate even more space on their modules.
Of course, development has only just begun, and we learn that substrate producers have been contacted by the major memory manufacturers. These include Samsung, SK Hynix and Micron. Clearly, the race is on, and for these companies, the priority is to be the first to roll out their kits to capture the lion’s share of the market.
Expected between 2028 and 2029 for servers and data centers!
At present, we’re only at the beginning of the development of this memory standard. In fact, the first kits are only expected to go on sale… Well, estimated, from 2028, or even 2029. And even then, this only concerns kits for professional use. The arrival of DDR6 in the consumer sector could only come one or two years later. So, expect this standard to arrive between 2029 and 2030.
