A new heatsink from Thermalright, announcing the arrival of its small AXP90-X53. It’s a compact reference in top-flow format, built entirely in copper.
AXP90-X53: 100% copper!
With this heatsink, we return to the same base as the original model we mentioned here. This translates into dimensions of 94.5 (W) x 95 (D) x 53 (H) mm, including fan.
Here, the construction is entirely in copper, including the base, fins and heat pipes. The aim is to maximize heat dissipation capacity, while maintaining a small footprint. In this respect, copper is more efficient than aluminum… But it’s also more expensive and heavier.
In all cases, the structure consists of a dense network of copper fins crossed by four 6 mm copper heat pipes. This assembly is topped by a small 92 mm slim fan capable of operating at 2700 rpm at full throttle. At full throttle, airflow and static pressure will reach 42.58 CFM and 1.33 mmH2O.
Naturally, assembly is assured for mainstream platforms. This includes the LGA-1700/1200/115X, AM4 and AM5. However, don’t be too greedy – don’t go putting a CPU full of heart into it!
We’ll end with the price tag, which is 279 yuan, or around €35 after conversion.