AMD recently launched its Ryzen AI Max processors. It didn’t take long for these to be unveiled. In fact, Tony Yu, head of the Chinese division of ASUS, has given us a detailed technical presentation in a video on Bilibili.
Ryzen AI Max: naked!
As you can see, this processor model benefits from a multi-die design. There are two 67.07 mm² CCDs, each with up to eight Zen 5 cores. In the centre of each die, we find the L3 memory cache, through which we can see the screws for potentially accommodating 3D V-Cache memory. While for the moment AMD has not indicated any plans in this direction, in the future, if the competition proves to be a little too fierce, this leaves the company some room for manoeuvre.
In the centre is an imposing I/O die, which also houses the integrated GPU. The RX 8060S is powerful enough to rival dedicated mobile GPUs. At the same time, its configuration based on 40 compute units and 2560 stream processors is impressive.
Otherwise, this 307.58 mm² I/O die features an XDNA NPU to accelerate tasks linked to artificial intelligence. It is powerful enough for laptops equipped with Ryzen AI Max to be Microsoft Copilot+ certified. Other highlights include sixteen PCIe 4.0 lines and an AV1 encoder/decoder.
Finally, the CCDs and I/O die benefit from a shorter interconnect distance. Compared with a Ryzen desktop, the latter is 2 mm shorter. This reduces latency between the various processor components. Finally, this assembly benefits from 4nm production from TSMC.