We’re off to the console world with a minor revision of the PS5 Slim and some standard PS5s. Sony is revising the part of the heatsink that comes into contact with the console’s SoC. The aim is to prevent the liquid metal used as a thermal interface(TIM) from leaking over time.
PS5 Slim: models CFI-2100/2200 are the revised versions!
Liquid metal is a special kind of TIM, since it doesn’t dry out, or only dries out after a long time. As a result, when the console is placed vertically or moved around a lot, there’s a risk that it will leak. This leaves theAPU partially covered, creating hotspots. Inevitably, as the temperature rises, the console will seek to counterbalance this phenomenon, and the fan speed may increase, generating unwanted noise pollution.
To prevent the liquid metal from leaking out, the Japanese brand has redesigned the contact with the heatsink. The base now features small grooves to hold the TIM firmly in place. This revision is accompanied by model codes CFI-2100/2200.
It’s important to note that beyond these grooves, there are no other changes to the console. The heatsink, chassis, fan, etc. remain unchanged. However, this improvement should ensure the machine’s longevity over time, especially if you’re often on the move with your console, or if it’s left upright on your TV stand or similar. It is also expected that there will be no price increase as a result of this revision.
Finally, it might be a good idea to have your console overhauled if you notice that it is noisy despite being dusted. If the liquid metal is starting to go bad, it’s best to have it replaced by a professional, as its application is more complex than thermal paste.