At Computex 2026, AORUS unveiled several motherboards, including this AORUS INFINITY X870. As its name suggests, it is part of the “INFINITY” series, which we’ve already had the opportunity to review with the AORUS INFINITY RTX 5090, unveiled last January at CES 2026. At Computex, Gigabyte announced that it would be expanding the “INFINITY” series to include other RTX 50 models, as well as motherboards. This new addition is therefore built around the X870 chipset and features an AM5 socket.
A special thank you to AORUS for providing this unit and giving us the opportunity to be the first to introduce you to this AORUS INFINITY X870.
The Bundle:
The box for this AORUS INFINITY X870 showcases the new motherboard prominently, as the front features an image of the board with, at its center, the logo identifying AORUS products—the falcon—along with the “INFINITY” series name. The AORUS logo takes its inspiration from HORUS, the god of the sky in Egyptian mythology, who is represented by a crowned falcon. All the board’s features and specifications are listed on the back of the box. That concludes this brief history lesson on the brand’s logo; now let’s take a look at what’s inside the box.
Let’s take a quick look at the bundle included with this AORUS INFINITY X870 to see if it comes with any “special accessories.” After removing the user manual, stickers, a magnetic sticker, and the installation guide, we find a “cold plate”—as AORUS calls it—that can replace the CPU retention system. AORUS claims a temperature reduction of 8.5 °C for the power delivery stage and 6 °C for the memory. We’ll evaluate the difference and performance during our tests.
Other than that, the rest of the bundle is fairly standard, including two SATA cables, two external temperature sensors, a G-connector, and the Wi-Fi antenna.
The AM5 socket remains unchanged:
No changes regarding the AM5 socket; AMD is sticking with it and has announced that compatibility is expected to last until at least 2027. Say goodbye to the AM4 PGA (Pin Grid Array) socket, where you used to slot in your processor, and hello to the LGA (Land Grid Array) socket. This change took effect starting with the AMD Ryzen 7000 processors due to the higher pin count on the Ryzen 7000 series (1,718).
With the AM5 socket,AMD is retaining the backplate already used for the AM4 socket. The four outer holes that secure the retention system for attaching your cooling solution are still present. The center-to-center distance between these four holes is identical to that of the AM4 socket, so you’ll still be able to use your existing cooling solution.
AMD goes a step further and adds four additional holes that will be used not only to secure the AM5 socket in place but also to hold the backplate in place. This means the backplate should no longer need to be removed, as was the case with the previous generation. The locking mechanism features a reinforcement frame, a load-bearing frame, and a latch. Once your Ryzen 7000/9000 is properly positioned, simply close the latch to secure it in place.
The various heatsinks:
The board measures 305 mm x 275 mm, which corresponds to the E-ATX form factor. The dominant color on the PCB is black with gray lettering. The design is easily recognizable as an AORUS product thanks to the logo on one of the heatsinks. As you can see, the heatsinks are arranged in an unusual way, with both memory slots located at the top.
Let’s start our tour with the three heatsinks. The two large heatsinks are located at the top of the motherboard and cover the power delivery stages. These two heatsinks are connected by a heat pipe, and their role is to dissipate heat from the power delivery stages. You’ll also notice the numerous fins, which facilitate heat dissipation. AORUS also uses high-performance thermal pads with a thermal conductivity of 7 W/mK. This is an entirely passive cooling system. The PCB has 10 layers, and the power delivery system is based on an 18-phase (Vcore 110A) + 2-phase (SOC 110A) + 2-phase (MISC 60A) configuration.
A Plexiglas plate engraved with the AORUS logo is mounted on the largest of the heatsinks, which also cover the external connectors. It features RGB backlighting that lets you choose between illuminating the outline of the logo or creating a shadow effect beneath it when the logo is moved upward. The second heatsink is labeled “40 INFINITY.”
Finally, the third heatsink covers the chipset and has a fairly large surface area but is low-profile to allow for easy installation of graphics cards. The cutout fits perfectly and forms a “block” to cover two SSD slots. AORUS calls it “M.2 EZ-FLEX,” and it can be removed with one hand using a small clip on the right side.
Support for DDR5 and higher frequencies:
While DDR5 support has been available since the launch of AM5 motherboards, it has now been enhanced: thanks to new BIOS updates, AORUS announces support for memory kits reaching up to 11,400 MT/s (OC) with manual overclocking. This AORUS INFINITY X870 has only two memory slots, both located at the top of the board. This placement isn’t just for style; it creates a shorter distance to the socket, which is intended to improve memory overclocking by minimizing interference. This motherboard allows enthusiasts to maximize the memory overclocking capabilities of the latest AMD Ryzen processors.
Moving the two memory slots to the top also allows for better airflow between the front of your case and the CPU cooler, as the memory kit no longer blocks the airflow. It officially supports memory kits up to 9,600 MT/s (OC) for a maximum capacity of 128 GB.
We had actually seen the “EXPO” technology debut on the previous generation. It’s an alternative to the XMP profile on Intel models. As a reminder, this profile allows you to automatically enable your memory kit’s specifications—frequency, timings, and voltage—via the BIOS. AORUS also mentions “AI SNATCH,” which should allow you to boost the memory frequency with a single click within the BIOS. We’ll be keeping an eye on that.
Three M.2 SSD slots and PCIe 5.0 support:
To say the least, there’s plenty of room on the PCB, as we find no fewer than three slots. The first is topped by an imposing heatsink and features “M.2 EZ-FLEX” technology. The heatsink can be released with one hand using the clip at the top, and your SSD will snap into place with a simple press. So here we have a first slot capable of accommodating a PCIe 5.0 x4-compatible M.2 SSD of the 25110/22110/2580/2280 type.
In the lower section of the motherboard, the same principle applies with a cover that can be removed with a single click, as it uses the same technology. Once the heatsink is removed, you’ll have access to the other two M.2 SSD slots. The first is compatible with 22110/2280 PCIe 5.0 x4, and the second with 22110/2280 PCIe 4.0 x4. All M.2 slots feature a thermal pad on both sides of your SSD.
The motherboard features only two reinforced PCIe 5.0 16x ports to ensure they won’t be damaged if you regularly swap out your graphics card, as we do. Like the previous-generation X670E, this AORUS model is equipped with a button called “PCIe EZ-LATCH UP.” When a card is inserted into its PCIe slot, simply lift it by tilting it to remove it from the slot.
Overclocking tools and connectivity:
When it comes to overclocking, this is a motherboard designed for competitive-level overclocking, so it features a whole host of functions on the PCB as well as a BIOS specifically designed for this purpose. Starting from the top and working down, let’s take a look at the various buttons integrated directly onto the PCB:
- The CMOS button:resets the BIOS settings to their defaults.
- The RTY button:During cold-start tests, the OS sometimes freezes, and a reset won’t restart the motherboard—the only solution is to hold down the PWR button for 6–7 seconds. With the RTY button, it restarts immediately.
- The RESET button:allows you to restart the motherboard in case of a failure.
- The PWR button:powers on the motherboard.
- The two ECLK buttons: one is labeled “+” and the other “-”; they allow you to increase the processor’s clock speed.
- The Q-LED: displays a code corresponding to the component responsible for the error during boot; a unique feature of this model is that there are two of them.
- The Debug LED: 4 LEDs (CPU – DRAM – VGA – BOOT) that help diagnose errors during the board’s boot process . If one of them remains lit, it means the corresponding component is causing a problem.
- Voltage Test Points: Allow you to measure voltages directly on the PCB using a multimeter.
- BIOS SW:Allows you to switch between the two BIOSes. This lets you choose between an “overclocking” BIOS and a BIOS for 24/7 operation.
- The TGR SW:a button somewhat similar to“slow mode,” it allows you to lower the processor frequency and thus reduce the CPU temperature before running a benchmark, thereby increasing the chances that the benchmark will pass. Activate it to lower the temperature, then return it to its original position just before running your benchmark.
As for the connectivity options on our X870E AORUS INFINITY, it’s, of course, very comprehensive. First, there’s Q-FLASH PLUS, which lets you flash the BIOS from a USB drive, as well as the IGNITION button. This allows overclockers and DIY enthusiasts to pre-test water-cooling systems while building their computers without having to boot the system.
Another unique feature of this model is that it includes two PS/2 ports for connecting a keyboard and mouse. But why use this type of connector in 2021? Simply because certain benchmarks perform better under XP (Super Pi), and using non-USB peripherals greatly simplifies the OS installation process. As for the rest, it features an HDMI port, four USB 3.2 Gen 1 ports, three USB 3.2 Gen 2 Type-A ports, one USB4 Type-C port, one RJ-45 5G port, two Wi-Fi antenna connectors, two audio outputs, and one S/PDIF optical output.
Check back in a few days for the full review of this AORUS INFINITY X870E. Thanks to AORUS for providing this unit and giving us the opportunity to be the first to share it with you.
