Intel may be returning to some of its roots. Founded in 1968, the American company began its history with memory chips, notably the 3101 SRAM and later the 1103 DRAM. Since then, the company has primarily established itself in the processor market, but its CEO, Lip-Bu Tan, is now hinting that a return to memory is being seriously considered. The explosive growth in demand driven by artificial intelligence is indeed changing the landscape, to the point where memory is no longer considered merely a commodity market.
Intel Wants to Bring Processors and Memory Closer Together
During an interview with the TechSurge: Deep Tech VC podcast, Lip-Bu Tan explained that Intel is working on new architectures capable of meeting the high demand for computing power. This effort isn’t limited to CPUs alone. The company is also exploring various methods to integrate processors and memory more closely, particularly through 3D DRAM stacking. The goal is to reduce current bottlenecks in data exchange between computing units and memory.
Lip-Bu Tan also acknowledged that he had long been reluctant to invest in this sector, which was historically considered too dependent on prices and volumes. However, AI has profoundly changed the market. Demand for bandwidth and memory capacity is growing rapidly, paving the way for new architectures and further innovation. Intel is therefore reportedly exploring several avenues in the short, medium, and long term.
XBM and ZAM Could Pave the Way
Several signs indicate that Intel is already moving in this direction. Notably, the company has hired Seok-Hee Lee, former CEO of SK Hynix, as Executive Vice President in charge of the Foundry business and advanced packaging technologies. Intel is also developing the XBM and ZAM projects with various partners. ZAM is currently slated for the 2029–2030 period, while XBM could be unveiled at the start of the next decade.
This potential return comes after several forays into memory technology. Intel notably developed Optane based on 3D XPoint technology, designed in collaboration with Micron. Despite its unique features, Optane never achieved the expected success, and its development was ultimately discontinued in 2022. Solutions such as HBM and 3D-stacked memory architectures have since gained considerable importance.
One of my favorite projects is exploring new memory architectures, and I think you’ve seen the news: I’ve hired my friend Seok-Hee Lee, who used to lead SK Hynix. So you have an idea of what I’m thinking. We’re not ready to announce it yet, but you know, I’m always thinking about short-, medium-, and long-term needs. Lip-Bu Tan—CEO of Intel
A full-fledged return by Intel to the memory market could also strengthen Intel Foundry. The company would then be able to bring together semiconductor manufacturing, memory, and advanced packaging within a single ecosystem. This is a particularly interesting strategy as the growth of AI infrastructure continues to drive demand for computing power and memory.
