Russia is one of the most heavily sanctioned countries in the world, particularly in the technology sector. In fact, even for third-party players, if they collaborate with Russian companies deemed to be problematic, the axe falls, as we saw with DeepCool. In short, it is in this context that the country is trying to develop a 100% in-house semiconductor industry. What’s more, the country has passed the 350nm milestone!
Russia capable of producing 350nm chips!
There’s a world of difference between being able to design computer chips and controlling their production from start to finish. Admittedly, the Russians already design processors, the famous Baikal-S, but production is carried out abroad. Here, we’re talking about developing machines that can burn chips themselves, and that’s what the Zelenograd Nanotechnology Center has done in collaboration with the Belarusian company Planar.
Broadly speaking, the latter have succeeded in mastering 350 nm engraving using a laser system. The assembly then etches the surface of the silicon wafer using a photosensitive resin system. The shape of the circuit is established using a photomask. All that remains is to chemically remove the resin to produce functional chips.
In short, while some may laugh, this is a major step forward for a country that does not really have a semiconductor industry. It should also be pointed out that 350nm is a technology that dates back some thirty years. To give you an idea, the Pentium II used this type of etching. But first things first, and catching up with the West won’t happen in a single night. Remember that TSMC is currently capable of producing chips with a 3nm etch, with research currently moving towards 2nm.
In China, the competition is also fierce, with SMIC expected to complete the development of its 5nm chip this year. As for what’s next, we hear that Russia is aiming for 130nm by 2026. Stay tuned.