AMD roadmaps have just been revealed on YouTube by AdoredTV, concerning the EPYC Zen 4/4c/5 processors and the MI300 APU.
AMD EPYC Zen 4 and 5 are confirmed on the SP5 socket.
In a YouTube video, AdoredTV leaked several internal AMD documents about the brand’s server processors, with the EPYC Zen 4/4c and Zen 5 and the MI300 APU. Most of this information was already known for a long time, but would now be confirmed by these slides that seem to be official.
In 2022 and 2023 we will find the next EPYC in Zen 4 and Zen 4c, namely :
- Genoa with 96 Zen 4 cores divided into 12 CCDs of 8 cores, supporting PCIe 5.0 and DDR5, with a TDP up to 400W.
- Bergamo with 128 Zen 4c cores divided into 8 CCDs of 16 cores, also supporting PCIe 5.0 and DDR5, with a TDP up to 400W.
Both processors will use two sockets, the “classic” SP5 and the “embedded” SP6. The successors, named Turin and using Zen 5, will also arrive on the SP5 and SP6 socket. Concerning the characteristics we would be on 256 cores and 512 threads.
About the embedded versions on the SP6, a socket with reduced characteristics compared to the SP5 (number of DDR5 channels, PCIe line or CXL line), there will be a maximum of 32 Zen 4 cores or 64 cores in Zen 4c, with TDP up to 225W.
The MI300 APU with Zen 4 and CDNA3
The MI300 which will replace the current MI200, would be really an APU equipped with a Zen 4 processor and a CDNA3 GPU, the whole coupled with HBM memory shared between the two. The card should thus arrive at AMD for testing in the third quarter of 2022.
